Samsung: 1.4 nm Process Technology in Production by 2027 – High-Performance Computing News Analysis | insideHPC – insideHPC
At its Foundry Forum today within San Jose, Samsung Electronics spotlighted the foundry business strategy with emphasis on high performance computing (HPC), artificial intelligence (AI), 5/6G connectivity and automotive applications. A featured announcement: Samsung committed to bringing 1. 4-nanometer (nm), for production in 2027.
That will be preceded by the introduction of 2nm process in 2025 and follows its latest 3nm procedure technology that is in mass production now, the company said.
“ Samsung is also accelerating the development of 2. 5D/3D heterogeneous integration packaging technology to provide a total system solution in foundry services, ” the company said in its announcement. “Through continuous innovation, its 3D packaging X-Cube with micro-bump interconnection will be ready for mass production in 2024, and bump-less X-Cube will be available within 2026. ”
Samsung also stated it will enhance its gate-all-around (GAA)-based 3nm process support for HPC and mobile, while diversifying the 4nm process specialized for HPC and auto applications.
Samsung plans in order to expand manufacturing for the advanced nodes simply by more than three times over current capacity by 2027. Including the particular new fab under construction in Taylor, Texas, Samsung’s foundry manufacturing lines are in five locations: Giheung, Hwaseong, and Pyeongtaek inside Korea; plus Austin and Taylor in Texas.
Samsung also detailed its ‘Shell-First’ strategy with regard to capacity investment, building cleanrooms first irrespective of market conditions. With cleanrooms readily available, fab equipment can be installed later and set up flexibly as needed within line along with future demand, the company mentioned. Through the new investment strategy, Samsung will certainly be able to better respond to customers’ demands.
Also unveiled were expense plans in a Shell-First manufacturing line in Taylor swift following the first line announced last year, as well as potential expansion of Samsung’s global semiconductor production network.
Samsung said it is going to hold the ‘SAFE Forum’ (Samsung Advanced Foundry Ecosystem) on October 4 showing new foundry technologies plus strategies with ecosystem partners encompassing areas such as Electronic Design Automation (EDA), IP, Outsourced Semiconductor Assembly and Test (OSAT), Style Solution Partner (DSP) and the cloud.
In addition to 70 partner presentations, Samsung may introduce the possibility of applying Samsung’s processes, such as design technology co-optimization regarding GAA plus 2. 5D/3DIC.
As associated with 2022, Samsung said it provides a lot more than 4, 000 IPs along with 56 companions and is also cooperating with nine and 22 partners in the design solution and EDA, respectively. It also offers fog up services with nine partners and product packaging services along with 10 companions.
The Samsung Foundry Discussion board will become sequentially held in Europe (Munich) upon the 7th, Tokyo on the 18th, and Seoul around the 20th.