Electronics Asia Conference 2022 Just Around the Corner – Eetasia.com

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Article By: EE Times Asia

With the theme “Gearing Up for Growth: Electronics and Semiconductor Technologies Driving Industry Developments in Asia, ” EAC 2022 will focus on applications including IoT, wireless technologies, automotive electronics, and the particular supply chain.

The inaugural Electronics Asia Conference (EAC) 2022, organized by AspenCore , the publisher of EETimes Asia , EETimes India , and EDN Asia , will feature  a virtual conference and exhibition, highlighting the latest technology trends, innovations and developments, and strategies to help the electronics and semiconductor industry stakeholders navigate the challenges, take advantage of, and build new opportunities in the current global manufacturing landscape.

With the theme “Gearing Up for Growth: Electronics and Semiconductor Technologies Driving Industry Developments in Asia, ” this year’s event, to be held from October 18–20, will focus on industries and applications including IoT, wireless technologies, automotive electronics, and the supply chain.

Day 1 (October 18)

Internet of Things (IoT) 

• Steven Liu, GP Product Marketing Manager, Texas Instruments

Revolutionizing HMI/IoT Gateway Design

The continuing evolution associated with Industry 4. 0 is driving differentiation in semiconductor devices, requiring rich on-chip resources to build unique systems that are cost-efficient, with more MPU performance for edge compute/AI implementation, and enhanced security features to protect privacy plus IP design. Learn how TI’s new generation flagship device family, the AM62x, will help revolutionize your next-generation HMI/IoT gateway design.

• Somashekhar Pattanashetti, Director of Engineering for India, Arrow Electronics 

How IoT Technology Enhanced Water Quality for Thousands inside Indian Villages

In collaboration with the particular Software Technology Park of India (STPI), Arrow Electronics has helped a local innovative startup, RefillBot, develop a Remote Monitoring and Management (RMM) solution aimed at improving access to clean water in Indian villages. Powered by advanced sensing and IoT systems that allow real-time, 24/7 water quality monitoring, the new RMM platform has been successfully rolled out across 100 villages in India’s Karnataka state in just four months. As an STPI incubatee, RefillBot used the Arrow/STPI IoT Open Lab’s equipment to test plus verify its boards, and consulted plus collaborated with Arrow on system style as well as the selection of cutting-edge components. Here’s how Arrow engineers and technical experts helped RefillBot bring the solution to life.

• Allen Huang, Senior AIoT Solution Manager, Arm

Arm’s Project Cassini: Enabling Cloud-Native Experiences at the Edge

As the nature of compute changes, the edge plays an increasingly crucial role in supporting diverse systems with a range of power and performance requirements. To deliver on service level agreements at scale for enterprises, the edge must embrace cloud-native software principles. Project Cassini is the open, collaborative, standards-based initiative to deliver a seamless cloud-native computer software experience for devices. Find out more about how IoT and infrastructure edge solutions developers can access the power of Cassini today.

• Robin Feng, Strategic Marketing Manager, STMicroelectronics

Powering the Industrial Automation Revolution

This presentation puts into the spotlight the latest technology innovations in Industry 4. 0, and how STMicroelectronics’ factory automation solutions are helping manufacturers take their processes to the next level.

• John Chien, Sr. FAE Manager, Diodes Inc.

Power and Connectivity Components in IoT Designs and Applications

Here is a look at how device manufacturers are innovating their power and connectivity components to keep pace with the ever-increasing technical requirements of new IoT system designs and applications.

• Adrian Gan, Senior Regional Marketing Manager, Infineon Technologies

Xensiv: The Go-To Sensor Platform for IoT Device Development

Enabling the creation of new prototype ideas based on Infineon Technologies’ radar and environmental sensors, the Xensiv connected sensor kit (CSK) is the go-to sensor platform for Internet of Things (IoT) device development. In this technology presentation, Adrian Gan, Senior Product Management Manager at Infineon Technologies, will discuss how manufacturers in the IoT space can rapidly design, develop, and manufacture products depending on a development ecosystem.


Supply Chain

• Venketa Simhadri, CEO & Managing Director, MosChip, MosChip Technologies 

Semiconductor Supply Chain in India – Design Services and IP Perspective

Today, more than 20% of the world’s semiconductor designers are working out of India. With around 120, 000 chip designers, the country is already playing a major role in the global semiconductor design ecosystem. With this keynote, Venketa Simhadri, CEO & Managing Director of MosChip Technologies, will provide an in-depth look at the latest developments happening in India’s electronics and semiconductor manufacturing industry.

• Claudio Chan, Managing Director, China, SMITH

Semiconductor Sourcing Goals: 5 Ways Your Distribution Partner Can Support You

Claudio Chan, Managing Director, China, at SMITH will talk about the sourcing risks and challenges amid the ongoing component shortage, and how distributors can help electronics manufacturers successfully navigate the current supply chain landscape.

• Daphne Tien, Vice President, Advertising & Business Development, APAC, Mouser Electronics

Now and Moving Forward: The Virtual Supply Chain in a Post-Pandemic Era

Daphne Tien, Vice President, Marketing & Business Development, APAC, with regard to Mouser Consumer electronics will talk about the present semiconductor supply chain challenges, including the particular “Great Chip Shortage”, and provide some strategies on how to ensure the resilience of supply chains.

• Sabrina Liu, General Manager of China, Chip 1 Exchange

Strategies regarding Successful Counterfeit Mitigation

Amid the ongoing component shortage, traceability will be becoming a big issue intended for electronics manufacturers who are sourcing their chips plus components outside of their own regular provide chain setup. In this discussion, Nick 1 Exchange will provide strategies for successful counterfeit mitigation.

• Miro Lin, CEO associated with Machine Tool Business Group (Taichung) of Fair Friend Group (FFG), Fair Buddy Group (FFG)

FFG Smart Manufacturing & Future Opportunities

Miro Lin, CEO of the particular Machine Device Business Team (Taichung) associated with Fair Friend Group (FFG), will discuss smart manufacturing—through advanced data services platforms and machine learning engines—is enabling future opportunities to get the manufacturing sector. He will also touch on how adopting advanced smart production technologies will help in integrated production management, maintenance management, and value-added services.


Day 2 (October 19)

Automotive Electronic devices

• Kenneth Lim, Senior Vice Chief executive, Automotive AP, Infineon Systems

Driving the Future of Mobility

Infineon drives the electrification and decarbonization of the mobility sector. And with the expertise inside sensing, connecting and protecting data, Infineon enables the particular digitalization of cars plus provides the basis for smart traffic concepts.

• Robert Schweiger, Director Automotive Solutions, Cadence Design Systems

Redefining Automotive Electronics

Automation throughout vehicle cockpits, driver assist systems, and autonomous driving is critical for new E/E architectures, sensor architectures, plus high-bandwidth in-vehicle communications. As part associated with the new zonal architectures to enable autonomous driving, radar, lidar, and cameras are vital sensors undergoing rapid improvements. A new class of high-performance system-on-chips (SoC) and system-in-packages (SiP) is needed in order to process all sensor information. Furthermore, the dramatic increase of the electronic content in vehicles drives the trends toward integrating more functionality on a chip, meeting stringent safety, reliability, and security requirements. Autonomous driving systems targeting maximum performance running at giga-hertz frequencies must be designed and optimized for scalability, power efficiency, thermal, and EMI robustness. This speak provides an overview of automotive trends plus the implications for SoC and system design pertaining to sensors and automated traveling platforms.

• Marcus Lim, Older Marketing Supervisor, NXP Semiconductors

Auto Semiconductor Technology and Innovations

Marcus Lim, Senior Marketing and advertising Manager at NXP Semiconductors, will talk about new styles and programs that are usually driving the particular increasing electronics and semiconductor content in cars, the increasing electrification of vehicles, and exactly how all these are impacting the particular innovations within and development of automotive semiconductors and semiconductor technologies.

• Yan Ching Lun, Senior Movie director, Product plus Solutions, Efinix

FPGA in Automotive Applications

Modern automobiles require extremely sophisticated, computationally intensive capabilities for such tasks as advanced driver assistance systems (ADAS), infotainment, control, networking, connectivity and security. Many of these applications involve machine vision coupled with artificial intelligence (AI), which the near sensing compute requirements are evolving rapidly with ever-increasing number of sensors, sensors fusion, AI/ML algorithms and system level partition. FPGAs are now implemented alone or together with CPUs in many automotive systems, as they provide compute acceleration, system integration flexibility, and algorithms adaptability. Efinix FPGAs deliver power, performance, and area advantages over traditional FPGA technologies, unlocking new applications and delivering rapid time to market. Within this presentation, we will discuss the automotive trends and FPGA’s role in driving the technology and innovation.

• Simon Teng, Senior Director, Automotive Partnership – APAC, Equip

Automotive Market Trends and Architecture Transition

The presentation will discuss the major trends in automotive industry, especially the connected, automated, and electrified vehicle, and the service business model in auto. To realize these major trends in vehicle design, the electrical & electronic architecture has to migrate into zonal and centralized one, and the software architecture must adopt the cloud-native paradigm.

• Sathish. S, Manager – Sales & Marketing, Molex

Molex Automotive Products and Solutions

Sathish S., Manager – Sales & Marketing, at Molex Automotive Companies Solutions, will be introducing Molex’s high-performance sealed connectors for #powertrain applications (such as ECUs, #sensors), which help endure harsh conditions; compact interconnect solutions meant for body consumer electronics to save on weight and PCB real estate; and a wide range of reliable and compact interconnect solutions plus NPIs designed for #electricvehicle (#EV) applications.

• Nachiket Hardas, Senior Principal Manager, Automotive New Business Creation Division, Automotive Solution Business Unit, Renesas Electronics Corp.

How to Maximize xEV Motor Performance

A global leader in microcontrollers, analog, power, SoC services and products and integrated platforms, Renesas provides the expertise, quality, and comprehensive solutions for a broad range of Automotive applications. Renesas xEV inverter reference is a comprehensive solution including Hardware and Software that will help reduce overall development cost, expedite time to market and achieve your own cost-effective inverter solution. We will look at one of its kind Hardware IP for Motor Control and various components and discover their impact on the inverter execution for Electric Powertrain in this session.

• Martin Spiteri, Elderly Director, Vehicle Automation plus Chassis, Auto Regional Centre Asia Pacific, Infineon Technologies Asia Pacific cycles Pte Ltd

Sensor Development in Cars

The key trends shaping our cars of tomorrow, electric automobiles (EV), sophisticated driver assistance systems (ADAS), and comfort and convenience electronics are usually driving the need for more and more sensors in vehicles. As we move away from combustion engines, brand new sensors technology and products are being developed to meet the particular growing requirements of the electric vehicles tractive program. The continuous directive in order to make automobiles safer along with driver support systems to the point of the particular vehicle becoming able to drive autonomously requires many different types of messfühler technologies offering precision, redundancy and reactivity beyond human capability.

One of largest suppliers associated with sensor products for auto systems plus building on more than 40 years of experience inside developing high precision and reliable items to meet the ever increasing demands in the fast evolving market, Infineon will share some key automotive sensor insights within this brief presentation.


Day 3 (October 20)

Wave of Wireless

• Lori Lee, Director, Marketing, APAC & The far east, Bluetooth SIG Inc.

BLE Audio: LE Sound Ushers in a New Period of Audio

Details associated with LE Sound, the next era of Bluetooth audio specifications will be delivered. Building upon 20 years of innovation, LE Audio will certainly enhance the overall performance of Wireless bluetooth audio, add support just for hearing aids, and introduce exciting new features that will allow the creation of brand new products and use cases. This year, THE Audio added Auracast™ Broadcast Audio, an innovative new Bluetooth capability using the potential to provide life-changing audio experiences will also be introduced. Using the introduction associated with Auracast™ Transmission Audio, Bluetooth technology is going to be installed in public locations, and people will interact with audio in various public venues and environments like never before.

• Desmond Chan, Senior Company Marketing Supervisor, Silicon Labs

Designing Smart City Applications with Silicon Labs Wi-SUN FAN Stack

Large-scale smart city, utilities, and Industrial Internet of Things (IIoT) applications rely on dense, low-power wireless outdoor networks. In this keynote, Silicon Labs discusses why Wi-SUN is an ideal technology for scalable and flexible implementation for smart city and metering applications, and how it can be used in electric vehicle (EV) charging, smart solar photovoltaic (PV) systems, and battery storage applications.

• Mahesh Basavaraju, Market Segment Manager – Wireless Communication, Rohde & Schwarz

Pushing the Limits of 5G

5G New Radio (5G NR) network rollouts are in full swing globally, with standardization advancing plus evolving in order to address new market verticals such as Industrial Internet of Things (IIoT). Here’s a look at the particular ongoing optimization of networks and early 5G devices, and some of those technological advancements leading to 5G superior and beyond. Moreover, find out how Rohde & Schwarz is working with partners and customers to provide end-to-end solutions to address those upcoming challenges.

• Wendell Boyd, Director of Sales, Asean and ANZ, Nordic Semiconductor, Nordic Semiconductor

How Emerging Connectivity Standards are Supporting New Applications and Services

Emerging long-range technology standards such as LTE-M and NB-IOT are both delivering brand new features and applications to developers. Together with the new standards such as 5G Non-Terrestrial Networks (NTN) and DECT NR+, they will bring even more possibilities to the industry. Combining these with existing short-range requirements such while Bluetooth Low Energy plus Wi-Fi, along with a flexible, truly ultra-low power platform, may allow for the purpose of the development of more sustainable and efficient “Things” for the IoT world. Find out exactly how Nordic is usually providing such solutions in order to clients today and past.

• James Murdock, Product Marketing Engineer LPCS, Texas Instruments

Next-Gen Bluetooth Low Energy (BLE) Solutions for Industrial and Factory Applications

Industry 4. 0 applications require ever greater levels of automation, monitoring, and control, enabled by low-power long-battery-life wireless connectivity. Here’s a look at how Texas Instruments’ latest Bluetooth Low Energy devices are enabling the following generation of industrial and factory automation and control, to make wireless connectivity proliferate throughout an industrial setting.

• Bonny Zhang, Product Marketing Manager, Memory & NFC, STMicroelectronics

Capturing the Essence of Industry 4. 0

Bonny Zhang, Product Marketing Manager, Memory & NFC, at STMicroelectronics will discuss near-field communications (NFC) technology for network commissioning, ultra-low power IoT asset tracking, and wireless technologies for factory automation.

For more information and to register, click here.

Expo booth:

New products & solutions, whitepaper downloads, reference designs, videos

3 Rounds Lucky Draw:

Register, join the conference, plus visit the particular booths for a chance to win great prizes.