Advanced Semiconductor Packaging Technologies in Data Centers: The Growth Drivers and the Cutting-Edge Use Cases – PR Newswire

BOSTON , Oct. 12, 2022 /PRNewswire/ — Semiconductors are the critical component that enables our digital life. Their development has come a long way; In 1971, the Intel 4004, which was the first single-chip processor, had just 2, 250 transistor counts, as of 2022, the particular most advanced processor has over 50 billion transistor counts! However, advancement comes at a price – both development and production costs have risen to the point that the industry is seeking an alternate solution to manage costs while continuing to deliver sophisticated products. Alongside this, there is the demand for smaller devices, the necessity for compact integration associated with heterogeneous components, as well as the need for higher interconnection densities, which is why superior semiconductor packaging has entered center stage.

In this article, we will cover the growth drivers of advanced semiconductor packaging technologies on data center applications, as well as give several examples of cutting-edge commercial server products that will adopt innovative semiconductor packaging technologies. The content of this article will be from IDTechEx’s newly released market research report, ” Advanced semiconductor product packaging 2022-2033 “. The programs of advanced semiconductor packaging technologies covered in the statement encompass beyond data centers to autonomous vehicles, 5G& 6G, plus consumer electronics.

Sophisticated Semiconductor Product packaging Technologies — A Critical Foundation for Next Generation ICs for High Performance Computing Applications/Data Centers

When designing a high energy-efficient system with regard to high performance computing (HPC) apps and information centers, there are three trends related to Si: more transistors, a lot more memories, and more interconnections between the logic IC and the memory. More transistors would require, amongst many challenges, chip design to go past the reticle limit, which is over and above the scope of sophisticated semiconductor product packaging. On the particular other hand, more memories, which can be achieved through high bandwidth on-chip memory as well as increased I/O counts, and more interconnections between the logic IC and memory, both can be realized by superior semiconductor packaging technologies.

Besides technological improvement, cost management continues in order to be a key topic in this area as well. Chiplet design has emerged as a way that helps the vendor to find the balance between cost and performance. Chiplet design is the modular approach to building processors. With chiplet style, different dies/chips can be created using the particular most appropriate process node, lowering the total cost of device by reducing the use of the state-of-the-art process client (expensive! ) for unnecessary parts. Another driver regarding chiplet style is the particular need for more I/O. Packaging I/O dies such as SerDes, PCIEs, memory space I/O, plus so on the same module with processing units utilizing 2 . 5D or equivalent semiconductor product packaging technology allows for increased I/O matters in a system. 2. 5D advanced semiconductor packaging is the only technology to enable sub-micron routing available today.

State-Of-the Art Make use of Cases and Future Development Trend

Let’s have a look at some associated with the most current commercial products that will have either used or are likely to implement advanced semiconductor packaging systems in this particular industry. Take the adoption in machine CPU as an example. The majority of current server CPUs being based on monolithic SoC (system upon chip), Intel announced in 2021 that its next generation server CPU, Sapphire Rapids, will be based on a four-chip component interlinked via Embedded Multi-die Interconnect Bridge (EMIB). EMIB is Intel’s 2. 5D advanced semiconductor packaging solution. Meanwhile, AMD is leveraging the power of 3D advanced semiconductor packaging technology to stack a cache die directly on top of the processor to boost the overall performance of its latest server CPU Milan-X (products launched in Mar. 2022). AMD claim that the 3D packaging enables the > 200x interconnect density compared to regular 2D product packaging. With both the particular 1st plus 2nd leading server PROCESSOR supplier using advanced semiconductor packaging technologies in their newest state-of-the-art product, it is expected that the field’s ownership of innovative semiconductor packaging technologies will only expand. In addition to machine CPUs, intended for other parts in the particular data center, like accelerators, advanced semiconductor packaging technology has also been adopted already. For example, NVIDIA has been using TSMC’s second . 5D packaging technology – CoWoS (Chip on Wafer about Substrate) : for its high-end GPU accelerators since 2016.

Even though several high-end industrial products have already used 2. 5D advanced semiconductor packaging systems, numerous advancement initiatives are currently underway to further improve the efficiency of such devices and expand the package size to accommodate additional elements. The growth will progress beyond two. 5D integration. Ultimately, the particular goal is usually to have a completely THREE DIMENSIONAL integration where many logic ICs plus memory are physically placed on top of one another. However , the road is simply by no means simple. Thermal management and manufacturing face several problems that have yet to be overcome.

Finally, given the world’s expanding need to get data centers, advancements within advanced semiconductor packaging technology, which are crucial to the next generation of integrated circuits (ICs) pertaining to high-performance processing applications, will have a substantial market influence.

Advanced Semiconductor Packaging 2023-2033 inch, a new market research record from IDTechEx, examines the most recent developments plus trends inside advanced semiconductor packaging technologies, key player analyses, and market prospects.

Below lists key aspects of the review:

Technology trends, manufacturer analysis, and marketplace outlook

–  Detailed overview of Si IC industry – including technology roadmap plus player dynamics

–  Analysis of supply chain and business model within the semiconductor IC industry

–  Evaluation of different semiconductor packaging technologies

–  In-depth analysis associated with key company advanced semiconductor packaging systems – including the company’s state-of-the-art technologies and future research development

–  Detailed overview of key markets for advanced semiconductor product packaging. Including high-performance computing, autonomous vehicles, 5G, and consumer electronics

–  Numerous case studies demonstrating the use of sophisticated semiconductor packaging in variety of applications

–  Market scalability of key advanced semiconductor packaging technology (including 2 . 5D embedded Si, second . 5 Si interposer, 2 . 5D (Ultra) high denseness fanout, plus 3D die stacking) in the four primary marketplaces (Data middle, Autonomous vehicles, 5G, Consumer electronics) studied by IDTechEx. This information is translated to a 10-year granular market forecasts & evaluation

To find out about this IDTechEx survey, including downloadable sample pages, please visit www.IDTechEx.com/ASP .

IDTechEx’s marketplace research is definitely differentiated through the primary information gathered, technical depth, and unbiased appraisals, IDTechEx covers a wide range associated with topics plus helping understand the business pain points and unmet needs. For more information visit www.IDTechEx.com/research .

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